- Kostenlose Lieferung Deutschland
- In einem hochwertigen Holzrahmen montiert.
- Fertig zum Aufhängen der Wandkunst
- Vorderseite mit Acryl-Plexiglas
- Handgefertigt in unserer Werkstatt in Großbritannien
1. Intelligent temperature control
2. Protect Motherboard, Desoldering PCBA Easily
3. Dual button design, adopting intergrated design of PCBA soldering and desoldering
4. Support: for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max
5. Adopting AC high-frequency heating, PID temperature algorithm, temperature rising faster and more accurate.
6. Adopt Magnetic Flip design, start dormancy mode by automatic induction, better protection for users.
7. Adopting Layer-Fit Integrated Design Scheme, to stretch the deformed PCBA easily for heating fit by buckle lock.
2. Protect Motherboard, Desoldering PCBA Easily
3. Dual button design, adopting intergrated design of PCBA soldering and desoldering
4. Support: for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max
5. Adopting AC high-frequency heating, PID temperature algorithm, temperature rising faster and more accurate.
6. Adopt Magnetic Flip design, start dormancy mode by automatic induction, better protection for users.
7. Adopting Layer-Fit Integrated Design Scheme, to stretch the deformed PCBA easily for heating fit by buckle lock.
Specification:
| General |
|
| Package Weight |
|
1. Intelligent temperature control
2. Protect Motherboard, Desoldering PCBA Easily
3. Dual button design, adopting intergrated design of PCBA soldering and desoldering
4. Support: for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max
5. Adopting AC high-frequency heating, PID temperature algorithm, temperature rising faster and more accurate.
6. Adopt Magnetic Flip design, start dormancy mode by automatic induction, better protection for users.
7. Adopting Layer-Fit Integrated Design Scheme, to stretch the deformed PCBA easily for heating fit by buckle lock.
2. Protect Motherboard, Desoldering PCBA Easily
3. Dual button design, adopting intergrated design of PCBA soldering and desoldering
4. Support: for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max
5. Adopting AC high-frequency heating, PID temperature algorithm, temperature rising faster and more accurate.
6. Adopt Magnetic Flip design, start dormancy mode by automatic induction, better protection for users.
7. Adopting Layer-Fit Integrated Design Scheme, to stretch the deformed PCBA easily for heating fit by buckle lock.
Specification:
| General |
|
| Package Weight |
|
Für Sie empfohlen
Zuletzt angesehen
Kontaktieren Sie uns
Teilen und 15 % Rabatt sichern!
Teilen Sie dieses Produkt einfach in einem der folgenden sozialen Netzwerke und Sie erhalten 15 % Rabatt!